Designed to provide environmental sealing for a range of substrates, at elevated temperatures. Manufactured by TE from radiation-crosslinked polyolefins, the inner wall melts when heated and is forced into interstices by the shrinking of the outer wall so that, when cooled, the substrate is encapsulated by a tough, protective moisture barrier.
Minimum shrink temperature: 80°C [176°F]
Minimum full recovery temperature: 110°C [230°F]
- 4:1 shrink ratio Environmental sealing
- High-strength bonding
- Well-suited connector sealing covering large diameter differences
- RoHS compliant