Encapsulates components, splices, and terminations where moisture resistance and mechanical protection are required. Encapsulant melts and flows to fill surface irregularities of the substrate. While still hot, the tubing can be blocked to form a wire breakout.
Minimum shrink temperature: 125°C [257°F]
Minimum full recovery temperature: 135°C [275°F]
- 3:1 shrink ratio Splash-resistant, moisture resistant covering; not intended for use where immersion in fluids is required
- Rugged protection against abrasion, vibration, and flexing
- Excellent strain relief and insulation of weak points
- RoHS compliant